SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Diodes Incorporated's 7-Channel DMOS transistor array drives inductive loads while dissipating minimal power
  • 0

Diodes Incorporated's 7-Channel DMOS transistor array drives inductive loads while dissipating minimal power

SemiMediaEdit
August 1, 2022

Diodes Corporation recently introduced a new transistor array, the DIODES™ ULN62003A, which consists of seven 500mA rated open-drain transistors, all of which have their sources connected to a common ground pin. Capable of driving a wide variety of loads, such as solenoids, relays, DC motors, and LED displays, this high-current transistor array is aimed at climate control and home appliance designs. The product can be utilized in washing machines, dryers, microwave ovens, and air conditioning units.

Fabricated with DMOSFET output transistors, the ULN62003A has an output voltage drop of just 0.2V. This is far lower than the bipolar devices with which it is pin-compatible. The resulting power dissipation reduction not only minimizes overall power usage but also mitigates thermal issues and improves reliability. It also allows more devices to be controlled while still maintaining the desired die temperature.

In addition, the device, with its support for input voltages down to -1V, has much greater flexibility and allows the GND pin to be used for detecting overcurrent situations. This capability further increases system robustness and broadens the applications that the ULN62003A can address. Clamping diodes are included on each of this transistor array’s outputs for protection and improved reliability when driving inductive loads.

The ULN62003A is supplied in a SO-16 package and offers a superior performance to many popular peripheral driver devices. It is available at $0.25 in 1000 piece quantities. For more information, please visit https://www.diodes.com/part/ULN62003A/. 

Related

Diodes Incorporated electronic components news ULN62003A
ST announces joint development of automotive chips with Volkswagen CARIAD
Previous
Nexperia introduces ultra-low capacitance ESD protection diodes to protect automotive data interfaces
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

May 29, 2026
0
ST issues new price increase notice effective June 28

ST issues new price increase notice effective June 28

May 29, 2026
0
PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

May 29, 2026
0
Samsung to invest $1.5 billion in Vietnam for first chip testing facility

Samsung to invest $1.5 billion in Vietnam for first chip testing facility

May 28, 2026
0
1
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator