SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › CEOs of chip companies and other companies call on Congress to strengthen US semiconductor research, design, and manufacturing
  • 0

CEOs of chip companies and other companies call on Congress to strengthen US semiconductor research, design, and manufacturing

SemiMediaEdit
December 2, 2021

According to the Semiconductor Industry Association (SIA), a semiconductor-based research, design, and manufacturing letter from a broad alliance of 59 CEOs and senior managers was sent to the leaders of the US Congress. These 59 CEOs include global leading semiconductor companies such as GlobalFoundries, AMD, Intel, Amkor, Texas Instruments, Analog Devices, Inc., Broadcom, Inc., Cirrus Logic, Infineon, Micron, NXP, NVIDIA, Qualcomm, Skyworks, etc. . The signatories of this letter represent the main sectors of the economy-including chips, automobiles, medical equipment, technology, telecommunications, manufacturing, etc.

SIA pointed out that the letter highlights the need for action on the CHIPS Act and FABS Act to ensure the U.S. is home to more semiconductor production and innovation, which will strengthen America’s economy, national security, and supply chain resilience over the long term.

“Semiconductors form the nerve center of our economy, national security, and critical infrastructure. Fully funding the CHIPS Act and enacting a strengthened FABS Act would provide a critical boost to U.S.-based semiconductor research, design, and manufacturing, while also turbocharging job creation and making our chip supply chains more resilient for years to come,” said John Neuffer, SIA president and CEO. “We applaud the action taken today by CEOs from a range of critical sectors, and we urge Congress to prioritize getting these bipartisan initiatives across the finish line this year.”

To read the letter, click here.

Related

electronic components news
Global semiconductor equipment sales increased by 38% year-on-year in the third quarter
Previous
Vishay introduced automotive-grade IHSR high-temperature inductor to provide ultra-low DCR, high-current filtering in 2525 case size for multi-phase power supplies.
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

VIS sees stronger second-half demand as foundry capacity remains fully utilized

VIS sees stronger second-half demand as foundry capacity remains fully utilized

June 1, 2026
0
TSMC may raise 3nm prices as AI chip demand strains advanced foundry capacity

TSMC may raise 3nm prices as AI chip demand strains advanced foundry capacity

June 1, 2026
0
ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

May 29, 2026
0
ST issues new price increase notice effective June 28

ST issues new price increase notice effective June 28

May 29, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator