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Samsung and Hynix's DRAM wafers suffer from yield problems
Qualcomm extends acquisition deadline for NXP Semiconductors to June 22
MLCC price may increase again shortly
Infineon Technology joins WiSA
Broadcom announces layoffs
Samsung Publishes 5G NR Standards Whitepaper
Fingerprint chips’ shipment volume are expected to drop by 10% this year
UMC to raise prices for 8-inch wafer foundry
China's semiconductor equipment spending soared 65% year-on-year
Toshiba and Ablic to collaborate on mixed signal IC development
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