MarketWatch

TSMC plans to issue US$4 billion unsecured corporate bonds to expand production capacity

TSMC plans to issue US$4 billion unsecured corporate bonds to expand production capacity

August 12, 2020
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Samsung plans to break ground on its P3 fab in Pyeongtaek in September

Samsung plans to break ground on its P3 fab in Pyeongtaek in September

August 11, 2020
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JSCJ's new IC packaging and testing plant in Suqian, Jiangsu will be put into use this month

JSCJ's new IC packaging and testing plant in Suqian, Jiangsu will be put into use this month

August 11, 2020
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ON Semiconductor plans to sell its production facility in Niigata, Japan

ON Semiconductor plans to sell its production facility in Niigata, Japan

August 10, 2020
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NXP breaks ground on expansion of IC testing center in Tianjin, China

NXP breaks ground on expansion of IC testing center in Tianjin, China

August 10, 2020
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TDK Ventures adds AI accelerator Groq to its investment portfolio

TDK Ventures adds AI accelerator Groq to its investment portfolio

August 6, 2020
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ROHM Philippines resumes 50% operations

ROHM Philippines resumes 50% operations

August 6, 2020
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SIA: Semiconductor market will remain uncertain in the second half of the year

SIA: Semiconductor market will remain uncertain in the second half of the year

August 5, 2020
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ADI cooperates with Intel on radio platform to meet 5G network design challenges

ADI cooperates with Intel on radio platform to meet 5G network design challenges

August 4, 2020
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Goodix completes acquisition of Dream Chip

Goodix completes acquisition of Dream Chip

August 4, 2020
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