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Micron opens first India OSAT plant to expand memory backend network
Samsung to phase out 2D NAND at Hwaseong line, shift to 1c DRAM
Samsung memory price hike to Apple highlights tight LPDDR5X supply
Hanwha report sees memory surge in 2026 as HBM gains traction
Broadcom targets 1 million stacked AI chips shipped by 2027
SK hynix, SanDisk launch HBF standard push for AI inference era
Axelera AI raises $250 million to scale Europa inference chips
Taalas raises $169 mln to push model-specific AI inference chips
Infineon says humanoid robots may drive future growth
TSMC advances new 2nm fab plan in southern Taiwan
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