Manufacturer

Texas Instruments announces new Bluetooth wireless MCUs, making high-quality RF and power performance more affordable

Texas Instruments announces new Bluetooth wireless MCUs, making high-quality RF and power performance more affordable

June 23, 2022

TDK introduces ultra-thin patterned coils to revolutionize wireless charging

TDK introduces ultra-thin patterned coils to revolutionize wireless charging

June 22, 2022

ST introduces 40V STripFET F8 MOSFETs to save energy and reduce noise

ST introduces 40V STripFET F8 MOSFETs to save energy and reduce noise

June 21, 2022

Infineon adds the AIROC™ CYW20820 Bluetooth® & Bluetooth® LE system on chip for flexibility, low power, and high-performance connectivity

Infineon adds the AIROC™ CYW20820 Bluetooth® & Bluetooth® LE system on chip for flexibility, low power, and high-performance connectivity

June 20, 2022

USB4 ESD devices from Nexperia provide optimum balance of protection and performance

USB4 ESD devices from Nexperia provide optimum balance of protection and performance

June 17, 2022

TDK introduces compact SMT common mode chokes for low-voltage applications

TDK introduces compact SMT common mode chokes for low-voltage applications

June 16, 2022

Vishay introduces 24 V XClampR™ TVS in SMC and DO 218AB packages, delivering industry's lowest high power density clamp ratio

Vishay introduces 24 V XClampR™ TVS in SMC and DO 218AB packages, delivering industry's lowest high power density clamp ratio

June 15, 2022

Infineon introduces world's first high-resolution 3D image sensor for automotive ISO26262 compliant

Infineon introduces world's first high-resolution 3D image sensor for automotive ISO26262 compliant

June 14, 2022

Vishay releases new low profile, AEC-Q200 qualified DC-Link film capacitor

June 10, 2022

TDK releases compact inductors with enhanced performance to meet the needs of smartphone power circuits

TDK releases compact inductors with enhanced performance to meet the needs of smartphone power circuits

June 9, 2022