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Vishay Intertechnology introduces 3 V ruggedized ENYCAPTM energy storage capacitors with long life and high moisture resistance
LG announced that its display panel production will no longer use Japanese-made hydrogen fluoride
Renesas introduces the R-Car Consortium Proactive Partner Program to accelerate automotive mobility innovation
Nexperia's new MJD bipolar transistor broadens its total power bipolar discrete device portfolio
LG launches the world's first 5G vehicle communication module based on Qualcomm chip
Infineon announces new microcontroller optimized for automotive 77 GHz radar applications
Qualcomm announces that its Snapdragon X55 modem has been adopted by more than 30 OEMs worldwide
ON Semiconductor's Wi-Fi chipset selected by Orange France for the new Livebox 5 gateway
TAIYO YUDEN triples the communications range of Bluetooth® 5 compatible wireless communications module
Microchip's new Bluetooth® 5.0 dual-mode solution helps reduce BOM in wireless audio design
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