October 11, 2024 /SemiMedia/ — Amkor, a global leader in semiconductor packaging and testing, recently announced the signing of a memorandum of understanding (MoU) with Taiwan Semiconductor Manufacturing Co. (TSMC) to provide advanced packaging and testing services in Arizona. The collaboration will include technologies such as integrated fan-out (InFO) and chip-on-wafer-on-substrate (CoWoS), aiming to strengthen the local semiconductor ecosystem.

Industry sources suggest that TSMC’s first Arizona plant will mass-produce 4nm chips, with support from Amkor's outsourced semiconductor assembly and testing (OSAT) services. This move aligns with the U.S. CHIPS Act's goal to localize advanced chip manufacturing.

Amkor emphasized that both companies will jointly determine the packaging technologies to meet the production capacity needs of shared clients. TSMC will leverage Amkor’s new facility in Peoria, Arizona, to provide turnkey advanced packaging and testing services for its customers, particularly those using TSMC’s advanced wafer fab in Phoenix.

According to the agreement, TSMC’s Arizona Fab 21 is already producing Apple’s A16 system-on-chip (SoC) for the iPhone 14 Pro. As production ramps up, output is expected to rise steadily. Based on Apple’s past use of InFO packaging, analysts predict that U.S.-made Apple chips could debut as early as next year.