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Infineon optimistic about its chip business in 2023
Infineon launches new Bluetooth LE SoC, supports latest bluetooth 5.4 specification
Infineon announces long-term agreement with UMC for the production of 40nm eNVM microcontrollers
Infineon introduces Wi-Fi 5 and Bluetooth® combo to extend battery life in IoT applications with up to 65% power reduction
Infineon releases highly integrated iMOTION IMI110 series for low-power devices
Infineon announces acquisition of GaN systems
Infineon’s new i-ToF imager enables smallest 3D camera systems with improved quantum efficiency at optimized cost
Infineon to start construction of chip fab in Germany
Infineon announces registration of its QDPAK and DDPAK packages as JEDEC standard for high power applications
Infineon launches new PDM microphone with small package and low power consumption
Infineon's new 160 V 3-phase gate driver IC integrates power management unit, current sense amplifier and overcurrent protection
Infineon announces new multi-year agreement with Resonac for the supply of SiC
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