SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Infineon’s new i-ToF imager enables smallest 3D camera systems with improved quantum efficiency at optimized cost
  • 0

Infineon’s new i-ToF imager enables smallest 3D camera systems with improved quantum efficiency at optimized cost

SemiMediaEdit
February 27, 2023

Feb. 27, 2023 /SemiMedia/ -- Infineon Technologies AG recently announced that it has cooperated with pmdtechnologies to launch the IRS2976C Time of Flight (TOF) VGA Sensor, a performance-enhancing evolution of the IRS2877C ToF VGA sensor and novel member of the REAL3™ product family.

The implementation of Infineon's advanced pixel technology enables the pixels to achieve a quantum efficiency of 30 percent and more, a level so far only attained by back-side illumination (BSI) sensors. Remarkably, this is accomplished while maintaining the superior cost advantage of front-side illumination (FSI) sensors. As a result, the IRS2976C sensor is the first ToF imager in the world to pass Googles Class 3 (Strong) certification for face ID, while seamlessly operating under the mobile device’s display.

The IRS2976C imager supports a number of long-range, low-power use cases that enable a measurement range of 10 meter and further. As with all members of the REAL3™ family, pmdtechnologies' patented Suppression of Background Illumination (SBI) technology is integrated into each pixel. This provides the robust data in high dynamic range (HDR) and sunlight scenes.

“Our unique ToF CMOS process ensures excellent sensitivity and robust operation in indoor and outdoor environments,” said Christian Herzum, Vice President 3D-sensing at Infineon. “In addition, our IRS2976C 3D ToF imager offers a high level of functionality and maximum flexibility to optimize 3D camera designs. The sensor is ideal for applications like secure authentication for smartphones, payment terminals, smart door locks and also for virtual and augmented reality (AR/VR) headsets, service robots, and various IoT devices.”

The IRS2976C offers system VGA resolution of 640 x 480 depth points. With the world's smallest form factor of 23 mm², the imager sensor is drop-in compatible to previous IRS2877C imager and allows an easy upgrade path. The high level of integration enables a reduced bill of material (BOM), lowest form factors and simplified design. In combination with IRS9102C, Infineon’s latest VCSEL driver, the new IRS2976C allows the design of the smallest 3D camera systems at optimized costs.

Engineering samples of the IRS2976C imager are available. The new product will be presented at Mobile World Congress 2023 in Barcelona, Spain. For more information, please visit www.infineon.com/real3.

Related

electronic components news Electronic components supplier Electronic parts supplier Infineon IRS2976C
Nikkei: Singapore will become one of the production centers of the semiconductor industry
Previous
ST releases ST-ONE controller family for USB Power Delivery applications up to 140W
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Mouser Electronics expands to the Philippines with local customer service center
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

GlobalWafers to launch Texas fab, first 12-inch silicon wafer plant in US

GlobalWafers to launch Texas fab, first 12-inch silicon wafer plant in US

May 12, 2025
0
Nexperia launches automotive-grade SiC MOSFETs to boost EV power efficiency

Nexperia launches automotive-grade SiC MOSFETs to boost EV power efficiency

May 12, 2025
0
Samsung raises DRAM prices, DDR4 increases by around 20%

Samsung raises DRAM prices, DDR4 increases by around 20%

May 12, 2025
0
Yageo raises offer for Shibaura Electronics to strengthen global sensor strategy

Yageo raises offer for Shibaura Electronics to strengthen global sensor strategy

May 9, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator