SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Murata to establish a joint venture with Ishihara Sangyo Kaisha and Fuji Titanium Industry to produce raw materials for ceramic capacitors.
  • 0

Murata to establish a joint venture with Ishihara Sangyo Kaisha and Fuji Titanium Industry to produce raw materials for ceramic capacitors.

SemiMediaEdit
September 19, 2022

Murata Manufacturing Co., Ltd. recently announced that it has signed a basic agreement with  Ishihara Sangyo Kaisha, Ltd. and Fuji Titanium Industry Co., Ltd., a wholly owned subsidiary of Ishihara Sangyo Kaisha, Ltd., to manufacture barium titanate for use in multilayer ceramic capacitors and other products.

Murata noted in the announcement that Fuji Titanium Industry Co., Ltd. is one of the company's suppliers, producing barium titanate, a material used in multilayer ceramic capacitors. In the context of the rapid development of IT equipment and the electrification of automobiles, as the demand for multilayer ceramic capacitors further increases, barium titanate, a material for multilayer ceramic capacitors, is becoming more and more important.

The announcement shows that the signing date of the basic agreement is September 16, 2022, and the date of establishment of the joint venture company is spring 2023 (to be determined). Details of the joint venture are currently being discussed.

Related

electronic components news Fuji Titanium Industry Ishihara Sangyo Kaisha Murata
NXP announces joining Silicon Catalyst as strategic partner
Previous
Vishay announces new IHHP power inductors to improve efficiency and space savings in IoT devices and portable electronics
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Yageo sees steady AI demand supporting high-end passive component growth

Yageo sees steady AI demand supporting high-end passive component growth

April 17, 2026
0
TSMC expands global 3nm capacity to meet rising AI demand

TSMC expands global 3nm capacity to meet rising AI demand

April 17, 2026
0
Microchip expands dsPIC33A DSC line for AI power and real-time control

Microchip expands dsPIC33A DSC line for AI power and real-time control

April 17, 2026
0
Vishay rolls out compact IHLP inductor for high-density power designs

Vishay rolls out compact IHLP inductor for high-density power designs

April 16, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator