UMC announced on July 6 that it will invest $5 billion to build a new fab, the Fab12i P3, in Singapore.
According to UMC, the planned monthly production capacity of the first phase of the new fab is 30,000 wafers. The new plant is mainly to meet the needs of 5G, Internet of Things and automotive electronics.
UMC also announced earlier that, in addition to the new fab expansion plan in Singapore's Fab 12i, it will also strategically cooperate with Japan's Denso company to produce automotive IGBTs in UMC Japan's 12-inch wafer fab.
