SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › ROHM and Zhenghai Group announce a joint venture in SiC power module business
  • 0

ROHM and Zhenghai Group announce a joint venture in SiC power module business

SemiMediaEdit
October 26, 2021

ROHM Co., Ltd. (ROHM) and Zhenghai Group Co., Ltd. (Zhenghai Group) have signed a joint venture agreement to establish a new company in the power module business.


The new company, “HAIMOSIC (SHANGHAI) CO.,LTD.” is scheduled to be established in China in December 2021, and will be owned 80% by Shanghai Zhenghai Semiconductor Technology Co., Ltd. (Zhenghai Semiconductor) of Zhenghai Group and 20% by ROHM.

The new company will engage in the joint venture business of development, design, manufacturing and sales of power modules using silicon carbide (SiC) power devices, with the aim of developing a power module business that is ideal for traction inverters and other applications in new energy vehicles. The agreement enables to develop highly efficient power modules by combining the inverter technology of the Zhenghai Group companies, the module technology of both companies, and ROHM's cutting-edge SiC chips.

The module products to be developed through the new company are already scheduled to be used in electric vehicles, and mass production will begin from 2022.

Related

electronic components news ROHM Zhenghai Group
Renesas announces development of next-generation wireless MCU supporting new Bluetooth 5.3 low power specification
Previous
ADI sells its Symeo radar division to indie Semiconductor
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Western Digital speeds deleveraging with SanDisk share sale

Western Digital speeds deleveraging with SanDisk share sale

February 19, 2026
0
UK chip startup Fractile to invest £100m to scale AI hardware production

UK chip startup Fractile to invest £100m to scale AI hardware production

February 18, 2026
0
Winbond expects up to 95% DRAM price jump as DDR4 shortage deepens

Winbond expects up to 95% DRAM price jump as DDR4 shortage deepens

February 18, 2026
0
TrendForce sees memory market topping foundry revenue in 2026 on AI server demand

TrendForce sees memory market topping foundry revenue in 2026 on AI server demand

February 17, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator