SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Distribution › TDK releases robust X2 capacitors for high-temperature requirements
  • 0

TDK releases robust X2 capacitors for high-temperature requirements

SemiMediaEdit
April 15, 2021

TDK Corporation recently released a new series of EPCOS MKP-X2 capacitors for interference suppression. In contrast to conventional models, which are designed for a maximum operating temperature of 110 °C, the new capacitors offer a maximum permissible operating temperature of 125 °C. The capacitance range of the B3292*P series ranges from 0.033 µF to 5.6 µF, and the maximum rated voltage is 305 V AC. Even under harsh environmental conditions, the capacitors offer a stable capacitance value, verified by the thermal humidity bias test with basic conditions of 85 °C, 85% relative humidity and an operating voltage of 240 V AC, for a duration of 500 hours. They are certified according to IEC 60384-14:2013/AMD1:2016 and approved according to AEC-Q200.

The capacitors are approved according to UL and EN and, depending on capacitance, are available in lead spacing of 15 mm, 22.5 mm and 27.5 mm. The housing, such as potting material, corresponds to UL94 V-0.

The typical fields of application of the new X2 capacitors include interference suppression in filters under harsh environmental conditions and at high operating temperatures, such as in automotive applications.

Main applications

  • Interference suppression at high operating temperatures, such as automotive applications

Main features and benefits

  • Increased operating temperature of 125 °C
  • Wide capacitance range from 0.033 µF to 5.6 µF
  • UL and EN approval, qualification according to AEC-Q200

More information please visit www.tdk-electronics.tdk.com/en/emi_capacitors

Related

electronic components news MKP-X2 TDK
Power outage at TSMC’s fab 14
Previous
IC Insights: Mainland chinese companies hold only 5% of global IC marketshare
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Samsung memory price hike to Apple highlights tight LPDDR5X supply

Samsung memory price hike to Apple highlights tight LPDDR5X supply

February 27, 2026
0
Hanwha report sees memory surge in 2026 as HBM gains traction

Hanwha report sees memory surge in 2026 as HBM gains traction

February 27, 2026
0
Broadcom targets 1 million stacked AI chips shipped by 2027

Broadcom targets 1 million stacked AI chips shipped by 2027

February 27, 2026
0
SK hynix, SanDisk launch HBF standard push for AI inference era

SK hynix, SanDisk launch HBF standard push for AI inference era

February 26, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator