SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Vishay releases new MLCCs to provide lead (Pb) bearing termination finishes
  • 0

Vishay releases new MLCCs to provide lead (Pb) bearing termination finishes

SemiMediaEdit
February 1, 2021

Vishay Intertechnology recently introduced a new series of surface-mount multilayer ceramic chip capacitors (MLCCs) with a lead (Pb)-bearing termination finish suitable for low Earth orbit (LEO) satellites and other space, military, and avionics applications requiring tin whisker mitigation. Operating temperatures can be as high as +150 °C.

The Vishay Vitramon VJ....32 Lead-Bearing Finish series offers a termination finish with a minimum lead (Pb) content of 4 %. Previously, the option for lead (Pb)-bearing termination finishes was reserved for more expensive Hi-Rel devices. The MLCCs released today provide designers with a cost-effective alternative for aerospace systems in which tin whiskers must be avoided but space-level reliability isn’t required.

Manufactured in noble metal electrode (NME) technology with a wet build process, the VJ....32 Lead-Bearing Finish series is available with C0G (NP0) and X7R dielectrics in five body sizes from 0402 to 1210. Devices with a C0G (NP0) dielectric feature low capacitance down to 1.0 pF, a temperature coefficient of capacitance (TCC) of 0 ppm/°C ± 30 ppm/°C from –55 °C to +125 °C, and an aging rate of 0 % maximum per decade. X7R devices provide higher capacitance to 1.0 µF, TCC of ± 15 % from -55 °C to +125 °C, and an aging rate of 1 % maximum per decade.

The MLCCs are qualified according to AEC‑Q200 to provide designers with Automotive Grade reliability. More information please visit http://www.vishay.com/ppg?45256.

Related

electronic components news Vishsay
NXP | Machine Learning and Image Processing Demystified
Previous
TSMC shortens lead time for automotive chips
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Rohm and Toshiba discuss combining power semiconductor operations

Rohm and Toshiba discuss combining power semiconductor operations

March 13, 2026
0
Top foundries post $46.3 bln revenue in Q4 2025 as TSMC keeps strong lead

Top foundries post $46.3 bln revenue in Q4 2025 as TSMC keeps strong lead

March 13, 2026
0
Microchip launches LX4580 mixed-signal IC for aerospace and defense systems

Microchip launches LX4580 mixed-signal IC for aerospace and defense systems

March 13, 2026
0
Infineon expands MCU market lead to 23.2% share in 2025

Infineon expands MCU market lead to 23.2% share in 2025

March 12, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator