SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › SK hynix aims to triple NAND sales in 5 years
  • 0

SK hynix aims to triple NAND sales in 5 years

SemiMediaEdit
November 5, 2020

According to Businesskorea, SK hynix said at its third-quarter financial conference that it will gain a leading position in the NAND market by acquiring the NAND business from Intel, and plans to triple its NAND sales within five years.

According to reports, SK hynix president Lee Seok-hee attended the company’s third-quarter financial conference and stated on the conference call that SK hynix will secure self-sustainable business strength in NAND within the next three years and grow SK hynix's NAND revenue to triple that of before the acquisition in the next five years. In addition, Sk hynix will ensure that the company takes a leading position in the memory market, only only a DRAM leader.

At the same time, SK hynix continued to maintain strong business performance, with operating profit of US$1.1 billion in the third quarter.

SK hynix said its strong performance is attributed to the rising demand for DRAM and NAND chips, especially from Huawei. The rebound in memory chip prices from last year's low is one of the reasons for the soaring profits.

Related

electronic components news SK Hynix
Skyworks gets approval to suuply Huawei
Previous
NXP release low-cost, low-power, MCU-based face recognition solution with liveness detection for touchless access control
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Vishay rolls out compact IHLP inductor for high-density power designs

Vishay rolls out compact IHLP inductor for high-density power designs

April 16, 2026
0
ADI opens Thailand backend plant to expand packaging and test capacity

ADI opens Thailand backend plant to expand packaging and test capacity

April 16, 2026
0
Broadcom expands AI chip deal with Meta to support data centers

Broadcom expands AI chip deal with Meta to support data centers

April 16, 2026
0
India pushes local electronics components manufacturing with 75 ECMS projects approved

India pushes local electronics components manufacturing with 75 ECMS projects approved

April 15, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Electronic components distributor
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator