SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Renesas releases Bluetooth low energy modules for ultra-low power IoT applications
  • 0

Renesas releases Bluetooth low energy modules for ultra-low power IoT applications

SemiMediaEdit
August 4, 2020

Renesas Electronics today announced sample shipment availability of the new RYZ012 Bluetooth® module targeting ultra-low power IoT applications. The RYZ012 is Renesas' first Bluetooth Low Energy 5 module. It integrates a 2.4 GHz RF transceiver supporting the IEEE802.15.4 multi-standard wireless protocol, Bluetooth Low Energy (LE), Bluetooth LE Mesh, and ZigBee. The RYZ012 features a power draw of only 0.4µA during deep sleep (without SRAM retention) allowing customers to extend battery life. The RYZ012 also includes a battery monitor to measure battery capacity and detect low power in battery-operated devices.

“The RYZ012 module complements our IoT connectivity solutions, featuring ultra-low power in a small form factor, designed to target a wide range of IoT, connected home, asset tracking, and cost-sensitive applications,” said Roger Wendelken, Senior Vice President, Head of MCU Business, IoT and Infrastructure Business Unit at Renesas. “The RYZ012 teams with Renesas’ sensor solutions to offer an end-to-end, device-to-cloud ecosystem.”

The RYZ012 module supports the 2.4 GHz IoT standards without the requirement for an external DSP. This reduces the number of external components required and the overall cost in system integration. The RYZ012 module includes a 32-bit microcontroller with an integrated 512kB flash memory and 64kB SRAM for application support. It comes in two versions: with and without an integrated antenna. This allows for implementation flexibility and the option for longer wireless range requirements.

The RYZ012 module will be certified for use in the U.S., Canada, EU, and Japan. Samples of the RYZ012 module (both versions) are available now, with full product availability later this year.

Related

Bluetooth low energy modules electronic components news Renesas RYZ012
Goodix completes acquisition of Dream Chip
Previous
ADI cooperates with Intel on radio platform to meet 5G network design challenges
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Diotec launches SiC Schottky diode for fast MOSFET short-circuit protection

Diotec launches SiC Schottky diode for fast MOSFET short-circuit protection

August 20, 2025
0
TSMC sets $30,000 price for 2nm wafers, targets AI and HPC clients

TSMC sets $30,000 price for 2nm wafers, targets AI and HPC clients

August 20, 2025
0
SK Hynix strengthens balance sheet on booming HBM demand

SK Hynix strengthens balance sheet on booming HBM demand

August 20, 2025
0
Littelfuse launches TMR-based magnetic angle sensors for precision industrial and automotive control

Littelfuse launches TMR-based magnetic angle sensors for precision industrial and automotive control

August 19, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator