SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Nikkei: Unigroup plans to start construction of its Chongqing DRAM factory by the end of the year and mass production in 2022
  • 0

Nikkei: Unigroup plans to start construction of its Chongqing DRAM factory by the end of the year and mass production in 2022

SemiMediaEdit
June 29, 2020

According to a report by Nikkei News last week, Tsinghua Unisplendour Group plans to start construction of its DRAM factory in Chongqing, China before the end of this year, and mass production is expected to be achieved in 2022.

According to sources, Tsinghua Unigroup's Chongqing factory will mainly produce DRAM chips for smartphones and other devices, and mass production is expected to be achieved in 2022. Although Unigroup has not disclosed the total investment amount and annual production capacity, the source said that Unigroup plans to invest RMB 800 billion in the DRAM business within 10 years.

In August last year, Unigroup and the Chongqing government signed a cooperation agreement to set up a DRAM general R&D center and a 300mm DRAM chip factory in Chongqing. It was originally expected to start construction at the end of last year and mass production in 2021. However, with the outbreak of the COVID-19 epidemic, the investment plan was postponed.

Related

electronic components news UNIGROUP Unigroup DRAM
Infineon releases new sensing and balancing IC for battery management systems in electric cars
Previous
Nexperia announces ‘Power Live’ virtual conference on July 2nd & 3rd 2020
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

AMD taps GlobalFoundries for MI500 photonics as it advances CPO design

AMD taps GlobalFoundries for MI500 photonics as it advances CPO design

April 22, 2026
0
Microchip launches CLB MCUs to improve timing control and cut system cost

Microchip launches CLB MCUs to improve timing control and cut system cost

April 22, 2026
0
EU to launch Chips Act 2.0 in May to speed funding and boost local ecosystem

EU to launch Chips Act 2.0 in May to speed funding and boost local ecosystem

April 22, 2026
0
Samsung targets May samples for HBM4E, eyes Nvidia AI demand

Samsung targets May samples for HBM4E, eyes Nvidia AI demand

April 21, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator