SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › SK Hynix cooperates with KAIST to improve IC manufacturing process
  • 0

SK Hynix cooperates with KAIST to improve IC manufacturing process

SemiMediaEdit
May 13, 2020

According to the Korea Times, SK Hynix said yesterday that it has established a partnership with the Korea Advanced Institute of Science and Technology (KAIST), the world’s top technology university, and will use artificial intelligence technology to improve the chip manufacturing process.

According to the memorandum of understanding, SK Hynix will provide data generated in the semiconductor manufacturing process to KAIST in real time through cloud computing. KAIST will use AI technology to analyze the data and help promote the development of the chip manufacturing process.

SK Hynix said it launched a cloud computing system at its headquarters in March this year. To enable KAIST to store the data provided, SK Hynix also set up a secure data store at the university’s Daejeon campus and its next-generation ICT research center, Seongnam-KAIST.

SK Hynix has been strengthening cooperation with Korean universities and colleges to further improve its capabilities in the semiconductor industry. The company's executives said that this cooperation is expected to help accelerate the development of chip manufacturing technology. In addition, the company has established a system that can immediately apply the AI algorithm developed by the university to the industrial field. It is hoped that this cooperation can train more AI professionals and promote the development of the semiconductor industry.

Related

electronic components news improve IC manufacturing KAIST SK Hynix
TAIYO YUDEN Expands Its Product Lineup of Bluetooth® 5 Compatible Wireless Communications Modules
Previous
Renesas launches advanced signal conditioner IC for Industry 4.0, medical and IoT sensor applications
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Samsung memory price hike to Apple highlights tight LPDDR5X supply

Samsung memory price hike to Apple highlights tight LPDDR5X supply

February 27, 2026
0
Hanwha report sees memory surge in 2026 as HBM gains traction

Hanwha report sees memory surge in 2026 as HBM gains traction

February 27, 2026
0
Broadcom targets 1 million stacked AI chips shipped by 2027

Broadcom targets 1 million stacked AI chips shipped by 2027

February 27, 2026
0
SK hynix, SanDisk launch HBF standard push for AI inference era

SK hynix, SanDisk launch HBF standard push for AI inference era

February 26, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator