SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › TAIYO YUDEN Expands Its Product Lineup of Bluetooth® 5 Compatible Wireless Communications Modules
  • 0

TAIYO YUDEN Expands Its Product Lineup of Bluetooth® 5 Compatible Wireless Communications Modules

SemiMediaEdit
May 12, 2020

TAIYO YUDEN recently announced the launch of wireless communications modules EYSNCNZWW (9.6x12.9x2.0 mm) and EYSNSNZWW (3.25x8.55x1.00 mm). Both are compatible with Core Specification version 5.2, which is the latest version of Bluetooth® 5.

These products support a direction-finding function that enables users to grasp location information, and are most suitable for IoT-related devices that are required to be small and thin, such as wearable devices, healthcare equipment, and handheld devices for logistics.

TAIYO YUDEN Expands Its Product Lineup of Bluetooth® 5 Compatible Wireless Communications Modules-SemiMedia

Availability
Mass production of the products will commence in May 2020, with a sample price of 3,000 yen per module.

Related

electronic components news Taiyo yuden Bluetooth module Taiyo Yuden wireless module
Vishay expands resistance range of MCA 1206 AT Precision series thin film chip resistors
Previous
SK Hynix cooperates with KAIST to improve IC manufacturing process
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Mouser Electronics expands to the Philippines with local customer service center
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Micron to phase out DDR4 as DRAM prices spike amid supply shift

Micron to phase out DDR4 as DRAM prices spike amid supply shift

June 16, 2025
0
Diodes debuts 64GT/s PCIe 6.0 ReDriver targeting AI servers and HPC systems

Diodes debuts 64GT/s PCIe 6.0 ReDriver targeting AI servers and HPC systems

June 16, 2025
0
Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

June 13, 2025
0
Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

June 13, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator