SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Infineon wins Honor Quality Award from Toyota Hirose Plant
  • 0

Infineon wins Honor Quality Award from Toyota Hirose Plant

SemiMediaEdit
April 1, 2020

Infineon Technologies AG has achieved an impeccable quality record in its deliveries to Toyota's Hirose plant for the sixth consecutive year. For this, the car manufacturer has now awarded Infineon the plant's highest quality award, the Honor Quality Award, for the third time in a row. Infineon is the first non-Japanese semiconductor company to achieve this.

At the Hirose plant, Toyota manufactures electronic components for automobiles. Infineon supplies the site with transceivers for the Controller Area Network (CAN). These devices enable different control units in the car to exchange data.

The plant awards quality prizes to its suppliers every year: the longer the zero-defect quality record of a supplier, the higher the award. The Honor Quality Award is presented to suppliers who have delivered zero-defect quality for at least four consecutive years. This year's award is Infineon's fourth Honor Quality Award and its twelfth Zero Defect Award in total from the Hirose plant since the beginning of the cooperation more than 18 years ago.

Related

electronic components news Infineon Infineon and Toyota
NXP announces wireless MCUs with built-in NFC for Thread and Zigbee
Previous
MagnaChip sells its foundry business and fab for $ 435 million
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

TSMC speeds up U.S. advanced packaging plans as CoWoS demand surges

TSMC speeds up U.S. advanced packaging plans as CoWoS demand surges

December 9, 2025
0
ROHM launches TOLL-package SiC MOSFETs to boost thermal performance and power density

ROHM launches TOLL-package SiC MOSFETs to boost thermal performance and power density

December 8, 2025
0
Vishay launches new 1200 V SiC power modules for automotive and energy systems

Vishay launches new 1200 V SiC power modules for automotive and energy systems

December 4, 2025
0
ROHM launches high-speed RPR-0730 optical sensor for industrial and printing systems

ROHM launches high-speed RPR-0730 optical sensor for industrial and printing systems

December 3, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator