SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Qualcomm's new Bluetooth chip enables entry-level Bluetooth headsets with noise reduction and voice assistant capabilities
  • 0

Qualcomm's new Bluetooth chip enables entry-level Bluetooth headsets with noise reduction and voice assistant capabilities

SemiMediaEdit
March 27, 2020

According to reports, Qualcomm recently released two new Bluetooth chips specifically designed for wireless headphones, QCC514x and QCC304x SoCs. Both chips support Qualcomm’s TrueWireless Mirroring technology for more reliable connectivity, while also supporting hardware with Qualcomm hybrid active noise reduction and digital assistant technology.

Qualcomm's TrueWireless Mirroring technology is that only one earbud maintains the Bluetooth connection with the smartphone, while the secondary bud mirrors the connected bud. This technology is engineered to deliver a rapid, seamless swap in multiple use cases.

The difference between QCC514x and QCC304x is whether a voice assistant is included. QCC514x can provide voice wake-up function like AirPods or Echo Buds, while QCC304x can only wake up voice assistant by pressing keys.

According to Qualcomm, the significance of the release of QCC304x is that entry-level headphones can also have high-end features such as voice assistants and active noise reduction. Today, the TWS earbuds market has a promising future, and it is a new opportunity for Qualcomm to enter the low-end market and occupy the dominant position.

For more information, please visit https://www.qualcomm.com/products/features/truewireless.

Related

electronic components news QCC304x QCC514x Qualcomm Bluetooth chip
Vishay's facilities in 6 countries disrupted by COVID-19
Previous
China lifts antitrust review of ASE and SPIL mergers
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Infineon partners with NVIDIA to advance humanoid robotics semiconductors

Infineon partners with NVIDIA to advance humanoid robotics semiconductors

August 29, 2025
0
Global semiconductor revenue forecast to exceed $1 trillion by 2030 on AI boom

Global semiconductor revenue forecast to exceed $1 trillion by 2030 on AI boom

August 29, 2025
0
Toshiba partners with SICC to boost SiC power semiconductor supply and technology

Toshiba partners with SICC to boost SiC power semiconductor supply and technology

August 28, 2025
0
Infineon expands 650V CoolSiC G2 with 75mΩ MOSFETs for compact high-power designs

Infineon expands 650V CoolSiC G2 with 75mΩ MOSFETs for compact high-power designs

August 28, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator