SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › IC Packaging and testing service provider UTAC announces sale
  • 0

IC Packaging and testing service provider UTAC announces sale

SemiMediaEdit
February 27, 2020

Recently, Singapore's semiconductor packaging and testing company UTAC issued a statement announcing the sale of the company to a global private equity firm.

UTAC is the world's top 10 semiconductor packaging and testing service provider, headquartered in Singapore, has 9 factories in 6 countries and regions around the world, and employs more than 10,000 people worldwide.

According to reports, UTAC's business is mainly focused on the automotive, industrial control, cloud computing and communications fields, which generally have higher profits. UTAC is the third largest automotive electronics device packaging and testing company in the world, with revenue and ranking behind Amkor and ASE. According to statistics, Amkor, ASE, and UTAC occupy 76% of the global automotive semiconductor packaging and testing market.

From the aspect of product technology, UTAC mainly focuses on the fields of analog power devices, digital-analog hybrid devices and sensors. Its QFN and Copper Clip packaging technologies are in the leading position in the industry.

UTAC's customers are major global semiconductor manufacturers, including ADI, Panasonic, Sony, TI, On Semiconductor, Elmos, ST, Microchip, and Maxim.

At present, the transaction is still subject to regulatory approval, and UTAC has not disclosed more information.

Related

electronic components news UTAC
OmniVision production capacity will be restored to 70% by the end of the month
Previous
GlobalFoudries announces wafer supply agreement with GlobalWafers
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Fire broke out at AKM factory in Japan
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
SEMI: Global semiconductor equipment sales are expected to hit a new record in 2024

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

onsemi Partners With Valens to Develop 3MP Automotive Image Sensor With Integrated MIPI A-PHY

onsemi Partners With Valens to Develop 3MP Automotive Image Sensor With Integrated MIPI A-PHY

September 24, 2026
0
Microchip Completes Hailo Acquisition to Expand Edge AI, Vision and Robotics Portfolio

Microchip Completes Hailo Acquisition to Expand Edge AI, Vision and Robotics Portfolio

September 23, 2026
0
Apple and Broadcom Extend $30 Billion-Plus Chip Partnership Through 2031 as Baltra AI Server Project Continues

Apple and Broadcom Extend $30 Billion-Plus Chip Partnership Through 2031 as Baltra AI Server Project Continues

September 23, 2026
0
onsemi to Adjust Prices Across Broader Product Range From October 10 as AI Power Demand Rises

onsemi to Adjust Prices Across Broader Product Range From October 10 as AI Power Demand Rises

September 22, 2026
0
1
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Electronic components distributor
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator