Last week, Texas Instruments said on a conference call that it will close its last two 150mm (6-inch) fabs in the next few years. At the same time, the next 300mm (12-inch) wafer fab is being built at its Richardson facility in Texas.
"This will be a multi-year plan and is expected to be completed no later than 2023-2025," Texas Instruments investor relations director Dave Pahl said on the conference call.
Pahl said that a significant portion of the approximately $ 1.5 billion produced in these two 150mm fabs each year will be transferred to 300mm fabs to increase productivity and economic efficiency.
TI said that the construction of the new 300mm wafer fab is expected to be completed by the end of 2021. Since 300mm wafers can produce more than twice as many analog chips as 150mm wafers, the new fab will be able to provide products with competitive delivery times and costs. One of the reasons for choosing Richardson is because it is very close to its existing RFAB, which helps improve operational efficiency. The current 300mm wafer fab RFAB opened in 2009 and focuses on the automotive and industrial markets.