SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Distribution › Nordic and Lierda sign new distribution agreement
  • 0

Nordic and Lierda sign new distribution agreement

SemiMediaEdit
April 16, 2019

Nordic Semiconductor recently announced a new distribution agreement with Lierda Science & Technology Group Co., Ltd. Headquartered in Hangzhou, China, Lierda specializes in developing embedded systems and machine-to-machine (M2M) solutions and providing design services to markets including mainland China, Hong Kong and Macau. This agreement covers the distribution and design support of Nordic's low-power Bluetooth, ANT+, IEEE 802.15.4 and 2.4GHz proprietary ultra-low-power wireless connectivity solutions for manufacturers, start-ups and OEMs.

Lierda will provide Nordic's full range of ULP wireless connectivity hardware, firmware, development tools and reference designs, including advanced multi-protocol high-end nRF52840 system-on-chip (SoC) supporting Bluetooth 5, ANT, IEEE 802.15.4 and 2.4 GHz proprietary technologies.

“Lierda complements Nordic's existing distribution in the Chinese market. This company focuses on serving potential new customer bases in North China and Central China, providing design to support local Chinese developers. This is in full compliance with Nordic's desire to provide low-power wireless connectivity solutions to the broadest possible customer base. China has tremendous opportunities to build high-tech, automation and smart home solutions," said Wendell Boyd, Director of Sales and Marketing at Nordic Semiconductor.

Related

electronic components news Lierda Nordic Semiconductor
Memory chip giants are subject to EU anti-monopoly investigation
Previous
Gartner: Samsung's leading position in the semiconductor market will be replaced by Intel
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Samsung Electronics faces largest-ever strike as labor talks collapse again

Samsung Electronics faces largest-ever strike as labor talks collapse again

May 20, 2026
0
Samsung Electronics launches emergency semiconductor production plan ahead of union strike

Samsung Electronics launches emergency semiconductor production plan ahead of union strike

May 19, 2026
0
Memory chip prices set to ease in late 2027 as AI demand drives global market volatility

Memory chip prices set to ease in late 2027 as AI demand drives global market volatility

May 19, 2026
0
Infineon expands XHP 2 CoolSiC MOSFET portfolio with 2300 V modules for renewable energy

Infineon expands XHP 2 CoolSiC MOSFET portfolio with 2300 V modules for renewable energy

May 19, 2026
0
1
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator