SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Samsung announced mass production of 1TB eUFS2.1
  • 0

Samsung announced mass production of 1TB eUFS2.1

SemiMediaEdit
January 30, 2019

Today, Samsung Electronics announced that the 1TB eUFS2.1 has officially entered the mass production phase.

The product uses Samsung's fifth-generation V-NAND technology. In the same package size (11.5mm x 13.0mm), the 1TB eUFS solution combines 16 stacked 512Gb V-NAND flash memories with a newly developed proprietary flash controller, double the capacity of the previous 512GB version. The new eUFS speeds up to 1,000MB/s per second, with random reads and writes of 58,000 IOPS and 50,000 IOPS, a 38% increase over 512GB.

Samsung plans to expand its fifth-generation 512Gb V-NAND production at its Pyeongtaek facility in South Korea in the first half of 2019 to fully meet the strong demand of global mobile device manufacturers for 1TB eUFS.

Related

electronic components news Sumsung
WPG Group's revenue and profit reached a record high last year
Previous
NXP | Priority Support- helping you to get to market faster
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Mouser Electronics expands to the Philippines with local customer service center
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

June 13, 2025
0
Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

June 13, 2025
0
Vishay expands AC03-CS resistor series with surface-mountable WSZ lead form

Vishay expands AC03-CS resistor series with surface-mountable WSZ lead form

June 12, 2025
0
Foundry revenue slips in Q1 amid geopolitical rush orders; AI and China subsidies to lift Q2 outlook

Foundry revenue slips in Q1 amid geopolitical rush orders; AI and China subsidies to lift Q2 outlook

June 11, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator