SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Cypress forms joint venture with SK Hynix
  • 0

Cypress forms joint venture with SK Hynix

SemiMediaEdit
October 31, 2018

Recently, Cypress Semiconductor announced a joint venture with SK Hynix System IC, a subsidiary of Sk Hynix, in Hong Kong to strengthen Cypress's technology for connectivity, computing and storage solutions in the automotive, industrial and IoT markets.

In terms of equity allocation, SK Hynix System IC has a 60% stake and Cypress has a 40% stake. In the first five years of the partnership, the joint venture will produce and sell Cypress's existing single-level cell (SLC) NAND products and will continue to invest in next-generation NAND products. In addition, Cypress will transfer a complete set of SLC NAND flash memory catalogs to joint ventures.

“This joint venture provides a path for sustained, stable long-term supply. We will continue to work on differentiation, which covers connectivity, computing and storage solutions. The target market for these solutions is the automotive, industrial and IoT market with longer design cycles,” said Hasanne El-Khoury, president and CEO of Cypress.

Related

Cypress Electronic component news joint venture SK Hynix
Arrow Electronics | Colorado Smart City Symposium 2018 Recap
Previous
Hitachi Chemical allegedly forged semiconductor packaging material test results
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
What is the root cause of the decline of the Japanese semiconductor industry?

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Vishay adds 550 V and 600 V options to 193 PUR-SI snap-in capacitors

Vishay adds 550 V and 600 V options to 193 PUR-SI snap-in capacitors

January 20, 2026
0
TDK rolls out ModCap UHP DC link capacitors for SiC-based high-power inverters

TDK rolls out ModCap UHP DC link capacitors for SiC-based high-power inverters

January 16, 2026
0
SK hynix plans advanced packaging plant in Cheongju for HBM production

SK hynix plans advanced packaging plant in Cheongju for HBM production

January 15, 2026
0
Microchip launches military-grade plastic TVS devices for aerospace use

Microchip launches military-grade plastic TVS devices for aerospace use

January 15, 2026
0
1
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator