April 3, 2026 /SemiMedia/ — According to media reports, Taiwan Semiconductor Manufacturing Co (TSMC) plans to introduce 3nm production at its second fabrication plant in Japan, marking a shift from mature nodes to more advanced chipmaking.

A company filing shows the site is expected to begin installing 3nm equipment around 2028, with production to follow. The plant is designed for a monthly capacity of about 15,000 12-inch wafers.

Earlier this year, CEO C.C. Wei said during a meeting with Japan’s prime minister that TSMC intends to produce 3nm chips at the second Japan fab.

TSMC’s earlier plans in Japan focused on mature and mid-range technologies, including 40nm, 22/28nm, 12/16nm and 6/7nm. The company has said total investment in its first and second fabs in Japan will exceed $20 billion, with combined monthly capacity reaching about 100,000 wafers.

The move to add 3nm capability shows TSMC is adjusting its global capacity mix and adding advanced production outside Taiwan.

Local media have reported that the second fab could involve investment of around $17 billion, though the company has not confirmed the figure. Its first Japan fab started mass production in late 2024.