March 11, 2026 /SemiMedia/ — Micron Technology will take part in a new semiconductor research effort led by Applied Materials aimed at developing memory technologies for artificial intelligence and high-performance computing.

Micron is joining the Applied Materials Equipment and Process Innovation and Commercialization (EPIC) Center as a founding partner. The program brings chipmakers and equipment suppliers together to work on new materials, processes and packaging methods for future chips.

The EPIC Center is part of Applied Materials’ long-term plan to expand semiconductor research investment. The company has said spending related to the project could reach as much as $5 billion as more customer projects move forward.

Under the cooperation, Micron and Applied Materials will focus on technologies for DRAM, high-bandwidth memory (HBM) and NAND flash. The work will combine Applied Materials’ equipment and process expertise with Micron’s research teams in Boise, Idaho.

Demand for advanced memory is rising as technology companies accelerate the build-out of AI infrastructure. Firms including OpenAI, Google and Microsoft are expanding data-center capacity to support AI systems, increasing the need for high-performance memory.

Industry estimates suggest large technology companies could spend at least $630 billion on AI infrastructure by 2026, supporting strong demand for DRAM, HBM and other memory products.

Applied Materials previously said the EPIC research center is expected to begin operations around 2026.