October 9, 2025 /SemiMedia/ — Texas Instruments (TI) has informed staff that it plans to initiate workforce reductions at its Dallas and Sherman facilities in December, tied to the shutdown of its 150 mm wafer manufacturing lines.

According to an employee who requested anonymity, TI disclosed the plan on September 25. The move coincides with the company’s broader strategy to wind down its remaining 150 mm wafer fabs in North Texas.

The insider added that TI had earlier promised preferential hiring in its new facilities for those who assisted in the shutdown of the legacy 150 mm fabs—but that commitment appears only partially honored. The reorganization could affect as many as 400 personnel, the source said.

More than 150 workers at TI’s 150 mm fab near North Central Expressway in Dallas have reportedly received layoff notices, with final employment dates set for December 12.

In an official statement, TI said it “regularly assesses how to improve operational efficiency and better support the company’s long-term strategy. Some recent organizational adjustments have impacted portions of our workforce. These include plans to shutter the remaining 150 mm wafer lines in Dallas and Sherman, a move now entering the final phase of our multi-year transition. These decisions are difficult, and our top priority is supporting long-term employees through these changes. TI’s long-term commitment to North Texas, including investment in the Sherman new fab, remains unchanged.”

Within the semiconductor sector, TI’s scaling back of 150 mm capacity is being interpreted as a sign that the company is accelerating its transition toward more advanced process nodes and optimizing its wafer manufacturing footprint.