SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › ST leads EU-backed STARLight project on 300mm silicon photonics
  • 0

ST leads EU-backed STARLight project on 300mm silicon photonics

SemiMediaEdit
October 1, 2025

October 1, 2025 /SemiMedia/ — STMicroelectronics said it is leading the EU-funded STARLight consortium, a program designed to establish Europe’s leadership in 300mm silicon photonics. The initiative brings together 24 companies and research institutions from 11 countries to create a unified platform for large-scale silicon photonics manufacturing.

The STARLight project focuses on developing high-bandwidth, energy-efficient photonic integrated circuits with integrated lasers and modulators, targeting next-generation datacenters, AI clusters, telecommunications and automotive systems. By combining CMOS silicon processes with photonic transmission, the technology aims to address scaling and power challenges in data-heavy applications.

Planned to run until 2028, STARLight will build a complete value chain for silicon photonics, from advanced wafer production to application-ready modules. The consortium expects the first innovations to benefit high-performance computing, optical interconnects, automotive sensing and emerging markets such as LIDAR and space applications.

The program was selected under the EU CHIPS Joint Undertaking and is positioned as a strategic step for Europe to secure a stronger role in global semiconductor innovation.

Related

onsemi to acquire Vcore power technology to expand AI data center power portfolio
Previous
Littelfuse launches IX3407B isolated gate driver for high-voltage power systems
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Samsung memory price hike to Apple highlights tight LPDDR5X supply

Samsung memory price hike to Apple highlights tight LPDDR5X supply

February 27, 2026
0
Hanwha report sees memory surge in 2026 as HBM gains traction

Hanwha report sees memory surge in 2026 as HBM gains traction

February 27, 2026
0
Broadcom targets 1 million stacked AI chips shipped by 2027

Broadcom targets 1 million stacked AI chips shipped by 2027

February 27, 2026
0
SK hynix, SanDisk launch HBF standard push for AI inference era

SK hynix, SanDisk launch HBF standard push for AI inference era

February 26, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator