SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Nexperia launches first 40-100 V automotive MLPAK MOSFETs for next-gen vehicle systems
  • 0

Nexperia launches first 40-100 V automotive MLPAK MOSFETs for next-gen vehicle systems

SemiMediaEdit
September 16, 2025

September 16, 2025 /SemiMedia/ — Nexperia has introduced its first range of 40-100 V automotive-grade MOSFETs in micro-lead packages (MLPAK), targeting applications such as body control, infotainment, reverse battery protection and in-vehicle LED lighting. The initial release includes 19 devices in MLPAK33-WF and the company’s first 40 V device in MLPAK56-WF, both featuring side-wettable flanks to improve solder joint inspection and automated optical inspection (AOI).

The launch comes as vehicle architectures shift from ECU-based systems to domain and zonal control, increasing the demand for efficient power components in DC/DC converters, inverters and battery management systems. Nexperia’s new MOSFETs combine cost efficiency with automotive-grade reliability, meeting AEC-Q101 qualification standards.

The portfolio offers a wide range of RDS(on) options and standardized footprints, enabling design flexibility and straightforward migration across packages. With high avalanche ratings, low spiking and strong switching performance, the devices can reduce the need for additional free-wheeling diodes or bulky snubbers, lowering overall system cost.

Nexperia said the release marks the beginning of a broader MLPAK roadmap, underscoring its strategy to deliver scalable, high-performance MOSFET solutions with proven quality and robust supply chain support.

To learn more about Nexperia’s new portfolio of automotive qualified 40-100 V MLPAK MOSFET products, visit: www.nexperia.com/mosfets.

Related

AEC-Q101 qualified automotive MOSFET battery management systems DC/DC converters electronic components news Electronic components supplier Electronic parts supplier LED lighting MLPAK package power semiconductors
Silicon Labs launches FG23L wireless SoC to expand sub-GHz IoT market
Previous
Micron halts quotes and prepares sharp price hikes for memory chips
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
What is the root cause of the decline of the Japanese semiconductor industry?

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

UK chip startup Fractile to invest £100m to scale AI hardware production

UK chip startup Fractile to invest £100m to scale AI hardware production

February 18, 2026
0
Winbond expects up to 95% DRAM price jump as DDR4 shortage deepens

Winbond expects up to 95% DRAM price jump as DDR4 shortage deepens

February 18, 2026
0
TrendForce sees memory market topping foundry revenue in 2026 on AI server demand

TrendForce sees memory market topping foundry revenue in 2026 on AI server demand

February 17, 2026
0
Murata completes ceramic capacitor R&D center to strengthen MLCC development pipeline

Murata completes ceramic capacitor R&D center to strengthen MLCC development pipeline

February 17, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator