SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › TDK expands smallest 0201 high-frequency inductors for mobile applications
  • 0

TDK expands smallest 0201 high-frequency inductors for mobile applications

SemiMediaEdit
May 22, 2025

May 22, 2025 /SemiMedia/ — TDK Corporation has expanded its MUQ0201022HA series of high-frequency inductors, introducing the industry’s smallest 0201 size (0.25 x 0.125 x 0.2 mm) components. These inductors maintain equivalent electrical performance to the existing larger 0402 size (0.4 x 0.2 mm) MHQ0402PSA series, with inductance values ranging from 0.6 nH to 3.6 nH. Mass production began in May 2025.

Driven by the demand for smaller and more advanced mobile devices such as smartphones and wearables, TDK applied proprietary patterning and sintering technologies to reduce the mounting area by roughly half without compromising high-frequency performance. This enables enhanced miniaturization and performance in semiconductor high-frequency front-end modules. TDK plans to further expand its lineup to meet evolving customer requirements in high-frequency inductors.

Key applications include impedance matching in mobile and wearable device high-frequency front-end modules. The product offers superior frequency characteristics in a smaller footprint, supporting advanced semiconductor device design and integration.

Related

0201 size inductors electronic component innovation high-frequency circuits high-frequency inductors impedance matching components miniaturized inductors mobile device components semiconductor components TDK inductors wearable device parts
Intel weighs sale of networking and edge unit to sharpen chip focus
Previous
STMicroelectronics upgrades Singapore R&D hub to fast-track lead-free piezoMEMS innovation
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

NXP releases 10BASE-T1S PMD transceivers for edge Ethernet

NXP releases 10BASE-T1S PMD transceivers for edge Ethernet

February 26, 2026
0
SK hynix says memory market turns seller-driven, prices seen rising through 2026

SK hynix says memory market turns seller-driven, prices seen rising through 2026

February 24, 2026
0
Infineon rolls out isolated gate drivers to support next wave of SiC power systems

Infineon rolls out isolated gate drivers to support next wave of SiC power systems

February 12, 2026
0
ST launches Stellar P3E automotive MCU with on-chip AI acceleration for SDV platforms

ST launches Stellar P3E automotive MCU with on-chip AI acceleration for SDV platforms

February 11, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator