April 22, 2025 /SemiMedia/ — Nexperia has introduced a new series of bidirectional ESD protection diodes in flip-chip land grid array (FC-LGA) packages, optimized for safeguarding high-speed data links in automotive systems, including in-vehicle Ethernet, camera modules, and infotainment interfaces like USB, HDMI, and PCIe.

The new flip-chip design eliminates bond wires and lead frames, significantly reducing parasitics and improving signal integrity. The 2- and 3-pin diodes offer ultra-low capacitance (<0.25 pF) and low insertion loss (-3 dB at 14.6 GHz), making them well-suited for multi-gigabit data communication.

Nexperia’s FC-LGA diodes maintain drop-in compatibility with standard DFN footprints while delivering bandwidth improvements of up to 6 GHz. The 3-pin versions additionally support two channels and matched capacitance, enhancing circuit stability and reducing PCB space requirements.

The portfolio includes devices with reverse working voltages ranging from 5 V to 30 V, enabling flexible protection across various system nodes. With products such as the PESD5V0H1BLG-Q and PESD5V0H2BFG-Q, Nexperia remains the only supplier offering flip-chip ESD diodes with side-wettable flanks (SWF) for AOI compliance in automotive-grade production.

“These devices are designed to meet the growing demand for high-speed data integrity in connected vehicles,” said Alexander Benedix, Head of Protection and Filtering at Nexperia. “By combining proven packaging innovation with automotive reliability, we are supporting the industry's shift towards data-intensive applications.”

Initial 5 V versions are already in mass production. Devices rated for 18 V, 24 V, and 30 V are sampling now and will enter volume production in Q2 2025. For more information, please visit: High speed automotive ESD.