SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Intel to begin high-volume 3nm chip production at Ireland's Fab 34
  • 0

Intel to begin high-volume 3nm chip production at Ireland's Fab 34

SemiMediaEdit
March 31, 2025

March 31, 2025 /SemiMedia/ — Intel plans to commence high-volume manufacturing (HVM) of 3nm (Intel 3) chips at its Fab 34 facility in Leixlip, Ireland, in 2025. This marks the company's second major production site for the node, following its Oregon operations, as it expands its advanced process technology footprint globally.

Intel 3, the company’s second-generation EUV node, delivers an 18% performance-per-watt improvement over Intel 4. The process is available for foundry customers and is being used to manufacture next-generation Xeon 6 scalable server processors. Given Europe's limited access to cutting-edge semiconductor technology, Intel sees its Intel 3 foundry services as a key competitive advantage.

To fund its expansion, Intel sold part of Fab 34 to private equity firm Apollo last year. The company is also advancing multiple foundry nodes, including Intel 4, Intel 3, and Intel 18A, while co-developing a 12nm process with UMC. In 2025, Intel aims to begin HVM of its Panther Lake processors on the Intel 18A node at its Arizona facilities, with Intel 14A expected to launch in 2026.

However, Intel’s European expansion faces hurdles, as its planned wafer fab in Magdeburg, Germany, and packaging plant in Poland remain on hold. Additionally, following the ousting of Pat Gelsinger in 2024, new CEO Justin Hotard’s strategy for Intel’s advanced manufacturing and foundry business remains under close watch.

Related

electronic components news Electronic components supplier Electronic parts supplier High-volume manufacturing Intel Intel 18A and 14A nodes Intel 3 process technology Intel 3nm chip production Intel EUV lithography Intel Fab 34 Ireland Intel foundry expansion Intel foundry services Intel semiconductor roadmap Xeon 6 server processors
Renesas introduces highly integrated LCD video processor that enables next-generation ASIL B automotive display systems
Previous
SK Hynix completes $8.85 billion acquisition of Intel’s NAND business
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Memory market braces for sharp NAND and DRAM price hikes

Memory market braces for sharp NAND and DRAM price hikes

September 16, 2025
0
Micron halts quotes and prepares sharp price hikes for memory chips

Micron halts quotes and prepares sharp price hikes for memory chips

September 16, 2025
0
Nexperia launches first 40-100 V automotive MLPAK MOSFETs for next-gen vehicle systems

Nexperia launches first 40-100 V automotive MLPAK MOSFETs for next-gen vehicle systems

September 16, 2025
0
MinebeaMitsumi exits bid, Yageo poised to acquire Shibaura Electronics

MinebeaMitsumi exits bid, Yageo poised to acquire Shibaura Electronics

September 15, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator