December 9, 2024 /SemiMedia/ — On December 4, Vanguard International Semiconductor (VIS) and NXP held a groundbreaking ceremony for their 12-inch (300mm) wafer fab in Tampines, Singapore, as part of their VSMC joint venture, which was established in September 2024.

The first wafer fab is set to begin mass production in 2027. After successful ramp-up, VIS and NXP will consider expanding their operations and evaluate the potential construction of a second wafer fab.

By 2029, the fab's monthly production capacity is expected to reach 55,000 12-inch wafers, creating around 1,500 job opportunities. The facility will focus on producing mature 130nm to 40nm chips, which will be used in automotive, industrial, consumer, and mobile applications.

In June 2024, VIS and NXP announced a joint investment of approximately $7.8 billion to establish the 12-inch wafer fab in Singapore. The VSMC joint venture was officially formed after receiving regulatory approval in September 2024.

VIS's chairman, Leuh Fang, expressed strong confidence in the 12-inch fab project, forecasting that once the fab reaches full capacity in five years, VIS's annual revenue will double from NT$50 billion to NT$100 billion.