SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Silicon Labs releases ultra-low-power Wi-Fi 6 and Bluetooth LE 5.4 modules to accelerate device deployment
  • 0

Silicon Labs releases ultra-low-power Wi-Fi 6 and Bluetooth LE 5.4 modules to accelerate device deployment

SemiMediaEdit
December 4, 2024

December 4, 2024 /SemiMedia/ — Silicon Labs recently announced the SiWx917Y ultra-low power Wi-Fi® 6 and Bluetooth® Low Energy (LE) 5.4 modules. As an extension of the successful Series 2 platform, these modules are designed to help device makers streamline the complex development and certification process for Wi-Fi 6 devices.

The new SiWx917Y modules deliver breakthrough power efficiency while providing robust wireless connectivity, advanced security, and a full-featured application processor, reducing design challenges, product size, costs, and time-to-revenue for device makers. Pre-certified for global regulatory standards and equipped with an optimized antenna, the SiWx917Y modules eliminate the need for lengthy RF optimization and certifications.

"Wi-Fi for IoT has evolved significantly, creating exciting opportunities for innovation. To help end device makers accelerate their full potential, we developed the SiWx917Y Wi-Fi 6 modules," announced Irvind Ghai, Vice President of Wi-Fi Solutions at Silicon Labs. "These pre-certified modules offer a streamlined solution, enabling manufacturers to easily integrate cutting-edge connectivity into their devices and focus on actual solution differentiation while reducing development costs."

The modules are ideal for low-power Wi-Fi applications across industries, including smart homes, building automation, healthcare devices, industrial sensors, and asset tracking.

Versatile and Efficient SiWx917Y Modules Deliver Cutting-Edge Wireless Capabilities

The SiWx917Y modules integrate Wi-Fi 6, Bluetooth LE 5.4, an ARM Cortex-M4 application processor, a wireless network processor, large memory, and a rich set of peripherals in a compact 16 x 21 x 2.3 mm package. Key features include:

  • Ultra-low power Wi-Fi 6 connectivity with intelligent power management
  • Dual-core architecture with dedicated application and wireless processors
  • Support for Matter protocol over Wi-Fi
  • Integrated antenna, RF pin and worldwide RF certifications
  • Multiple configurations and operational for design flexibility

The modules' intelligent power management enables connected sleep mode with as low as 20μA current with Target Wake Time (TWT) and 60-second keep-alive interval. This allows IoT devices like smart locks, thermostats, smart cameras, video doorbells, and industrial sensors to achieve multi-year battery life. The integrated ARM Cortex-M4 processor, large memory, and peripherals also enable sophisticated edge processing capabilities.

The module supports two operational modes: SiWG917Y for SoC (Wireless MCU) mode so customers can execute all application code in the Module's ARM Cortex-M4 core, and SiWN917Y for NCP mode (Network Co-processor) so customers can execute their application on a separate MCU while the Wi-Fi module manages communication functions.

The SiWx917Y modules are now generally available for purchase. For more information, please click here.

Related

Bluetooth LE 5.4 module electronic components news Electronic components supplier Electronic parts supplier Silicon Labs ultra-low-power Wi-Fi 6 module
Germany plans €2 billion subsidy for semiconductor industry
Previous
Nexperia responds to Wingtech's addition to U.S. Entity List
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Mouser Electronics expands to the Philippines with local customer service center
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

June 13, 2025
0
Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

June 13, 2025
0
Vishay expands AC03-CS resistor series with surface-mountable WSZ lead form

Vishay expands AC03-CS resistor series with surface-mountable WSZ lead form

June 12, 2025
0
Foundry revenue slips in Q1 amid geopolitical rush orders; AI and China subsidies to lift Q2 outlook

Foundry revenue slips in Q1 amid geopolitical rush orders; AI and China subsidies to lift Q2 outlook

June 11, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator