October 30, 2024 /SemiMedia/ — GlobalFoundries (GF) and NXP Semiconductors have announced a collaboration to develop next-generation solutions across automotive, IoT, and smart mobile devices. Leveraging GF’s 22FDX® technology, NXP aims to enhance power efficiency, performance, and time-to-market for its products. GF will manufacture 22FDX chips at facilities in Dresden, Germany, and Malta, New York, ensuring diverse geographic supply for NXP's customer base.

The 22FDX platform offers low-power, high-performance capabilities by adjusting to the lowest possible voltage, consuming up to 70% less power and delivering 50% higher performance than traditional CMOS technologies. This technology is designed for edge applications, optimizing energy management while integrating digital, analog, RF, power management, and non-volatile memory onto a single chip for enhanced efficiency.

“NXP’s innovative portfolio of high-performance solutions is crucial to enabling the essential technologies at the center of our increasingly connected world. GF’s 22FDX platform’s power efficiency and enhanced performance effectively enables our customers to build the next generation of connected and secure solutions. Additionally, GF’s robust manufacturing presence for 22FDX in Germany and the U.S. helps support our goals of having supply control and geographic resilience in our manufacturing base,” said Andy Micallef, executive vice president and chief operations and manufacturing officer at NXP Semiconductors

“Our close collaboration for over a decade has been a testament to the strength of our shared vision and commitment. As we move forward, we’re excited to build on this foundation and further enable NXP’s next-generation solutions with high-power efficiency and optimal performance, without customers needing to compromise on either,” said Niels Anderskouv, chief business officer at GF.

The collaboration builds on GF and NXP’s longstanding relationship, allowing NXP to provide solutions with high power efficiency, essential for connected automotive systems and IoT devices. GF’s AutoPro™ solutions within the 22FDX platform offer reliability for automotive-grade applications, including resistance to extreme temperatures up to 150°C, which supports the long-term durability of vehicle electronics.

By incorporating automotive-grade specifications and secure global manufacturing, GF’s 22FDX platform is positioned to support NXP’s goals in multiple high-growth markets.