SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Powerchip and Tata build India's first 12-inch wafer fab
  • 0

Powerchip and Tata build India's first 12-inch wafer fab

SemiMediaEdit
October 4, 2024

October 4, 2024 /SemiMedia/ — Powerchip Semiconductor Manufacturing Corp. has announced a partnership with Tata Electronics to establish India's first 12-inch wafer fab in Dholera, Gujarat. The final cooperation agreement was signed during a ceremony attended by Powerchip's General Manager Martin Chu and Tata Electronics CEO Randhir Thakur, with Powerchip Chairman Frank Huang also present.

The total investment for the wafer fab is $11 billion, with a planned monthly capacity of 50,000 wafers supporting technology nodes from 28 to 110 nanometers. This facility marks a significant milestone in India, addressing the country's lack of commercial wafer fabs.

The new wafer fab will manufacture various types of chips, including power management, panel driver chips, microcontrollers, and high-speed computing logic chips. These products will cater to the growing demands in markets such as AI, automotive, computing, storage, and wireless communication. Not only will it meet domestic market needs, but it will also open doors for India in the global semiconductor landscape.

Importantly, the collaboration between Powerchip and Tata Electronics will transfer mature process technologies and provide training for Indian employees, enhancing local skill levels and job opportunities. The Indian government estimates that the project will create over 20,000 high-tech jobs in the region.

With this 12-inch wafer fab, India will establish its own production capabilities in critical sectors like automotive chips, wireless communication, and artificial intelligence, reducing reliance on imports.

Related

electronic components news Electronic components supplier Electronic parts supplier Global semiconductor industry SEMI semiconductor equipment market
Vishay releases wireless charging Tx and Rx coils with up to 90% humidity resistance and a smaller footprint
Previous
SoC chip market to surpass $200 billion by 2029, with RISC-V and automotive sectors leading growth
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Mouser Electronics expands to the Philippines with local customer service center
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Microchip advances ASA-ML camera development ecosystem in Japan with Nippon Chemi-Con and NetVision

Microchip advances ASA-ML camera development ecosystem in Japan with Nippon Chemi-Con and NetVision

July 4, 2025
0
TSMC exits GaN foundry business as Navitas shifts to PSMC

TSMC exits GaN foundry business as Navitas shifts to PSMC

July 4, 2025
0
Intel shifts foundry focus to 14A process

Intel shifts foundry focus to 14A process

July 3, 2025
0
IBM strengthens alliance with Rapidus to target sub-1nm chip technologies

IBM strengthens alliance with Rapidus to target sub-1nm chip technologies

July 3, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator