SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Powerchip ends partnership with SBI on new chip fab
  • 0

Powerchip ends partnership with SBI on new chip fab

SemiMediaEdit
September 30, 2024

September 30, 2024 /SemiMedia/ — Powerchip Semiconductor has decided to terminate its partnership with Japan's SBI Holdings on the planned new semiconductor plant, according to a report by Nikkei. Powerchip confirmed it has halted the collaboration and has informed both Japan’s Ministry of Economy, Trade and Industry (METI) and SBI Holdings of its decision.

The partnership with SBI was structured under a FabIP model, where Powerchip would provide consultancy services, staff training, and technology transfer, while receiving service fees and royalties from the Japanese partner. Powerchip had no plans to take equity or play a leading role in the operation of the new plant.

SBI had applied for subsidies from METI and received support from the Japanese government. However, METI’s subsidy conditions required the new plant to guarantee continuous production for over 10 years. Since SBI, a financial firm, lacks semiconductor industry experience, METI insisted that Powerchip share the guarantee responsibility.

Powerchip, a publicly listed company in Taiwan, stated that guaranteeing the operations of a plant it does not control would violate Taiwan's securities regulations. As a result, Powerchip’s board resolved to terminate the partnership several months ago, notifying METI and SBI of its decision.

Related

electronic components news Electronic components supplier Electronic parts supplier UK Semiconductor
UK buys Coherent wafer fab for £20 million
Previous
Kingston cuts prices as mid-tier memory market faces inventory pressure
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Tesla plans $3 billion chip R&D fab in Texas, eyes Terafab project

Tesla plans $3 billion chip R&D fab in Texas, eyes Terafab project

April 23, 2026
0
SK hynix starts advanced packaging plant in Cheongju to boost HBM supply

SK hynix starts advanced packaging plant in Cheongju to boost HBM supply

April 23, 2026
0
TSMC targets 2029 advanced packaging plant in Arizona to support AI demand

TSMC targets 2029 advanced packaging plant in Arizona to support AI demand

April 23, 2026
0
AMD taps GlobalFoundries for MI500 photonics as it advances CPO design

AMD taps GlobalFoundries for MI500 photonics as it advances CPO design

April 22, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator