July 30, 2024 /SemiMedia/ -- According to insiders in the semiconductor equipment industry, TSMC expects to break ground on a new wafer fab in Germany around the end of 2024 and start mass production at the end of 2027.

The insider said TSMC has been recruiting builders and suppliers for the Dresden wafer fab for more than a year, and equipment suppliers including Marketech International have traveled to Dresden several times to prepare for the project.

According to current plans, the wafer fab will go into mass production in the fourth quarter of 2027 and gradually increase output to full capacity of 40,000 wafers per month in 2028.

According to earlier reports, TSMC's 12-inch wafer fab in Germany will focus on 28nm/22nm and 16nm/12nm processes, targeting the automotive and industrial application markets.