SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Malaysia aims to double semiconductor exports by 2030
  • 0

Malaysia aims to double semiconductor exports by 2030

SemiMediaEdit
July 29, 2024

July 29, 2024 /SemiMedia/ -- According to the report, Malaysia plans to double its exports of semiconductor devices to 1.2 trillion ringgit (about $257 billion) by 2030.

Wong Siew Hai, president of the Malaysian Semiconductor Industry Association, said the goal would consolidate Malaysia's position as the world's sixth-largest chip exporter.

“We estimate that we will need 300,000 talents to achieve this goal,” said Wong Siew Hai.

However, Malaysia is facing a shortage of local talent and is now resorting to recruiting talent from overseas.

According to data released by Malaysia, Malaysia exported semiconductor devices worth RM593 billion and RM575.45 billion in 2022 and 2023 respectively.

Related

electronic components news Electronic components supplier Electronic parts supplier Malaysia semiconductor
Nexperia launches new high-current eFuse with excellent current-limiting accuracy
Previous
Amkor receives $600 million in subsidies for new U.S. facility
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Renesas launches RA0L1 MCUs with ultra-low power and capacitive touch features

Renesas launches RA0L1 MCUs with ultra-low power and capacitive touch features

September 18, 2025
0
STMicroelectronics to invest $60 million in France for panel-level packaging pilot line

STMicroelectronics to invest $60 million in France for panel-level packaging pilot line

September 18, 2025
0
Global cellular IoT module shipments rise 17% in Q2, led by China and India

Global cellular IoT module shipments rise 17% in Q2, led by China and India

September 18, 2025
0
TSMC market share jumps to 38% as Foundry 2.0 growth accelerates

TSMC market share jumps to 38% as Foundry 2.0 growth accelerates

September 17, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator