SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › TDK releases solid-state battery material with 100 times higher energy density
  • 0

TDK releases solid-state battery material with 100 times higher energy density

SemiMediaEdit
July 9, 2024

July 9, 2024 /SemiMedia/ -- TDK Corporation recently announced that it has developed materials for its next-generation solid-state battery, CeraCharge, which has an energy density of 1,000 Wh/L, about 100 times the energy density of TDK's conventional solid-state batteries.

TDK’s technology is aimed at a solution that can be utilized in various wearable devices, such as wireless earphones, hearing aids and even smartwatches, with the goal of replacing existing coin cell batteries.

Utilizing TDK’s proprietary material technology, TDK has managed to develop a material for the new solid-state battery with a significantly higher energy density than TDK’s conventional mass-produced solid-state batteries (Type: CeraCharge) due to the use of oxide-based solid electrolyte and lithium alloy anodes. The use of oxide-based solid electrolyte makes batteries extremely safe. It is intended for use in wearable and other devices that come in direct contact with the human body.


The battery can be applied for replacing coin cell primary batteries in compliance with EU battery regulations, which require them to be replaced by rechargeable batteries, which is expected to contribute to the reduction of environmental impact.

Further information on existing CeraCharge products can be found under https://www.tdk.com/en/featured_stories/entry_024.html.

Related

CeraCharge Electronic chip supplier electronic components news Electronic components supplier TDK
SIA: Global semiconductor sales up 19.3% year-to-year in May
Previous
Supply chain: MPS chips are in short supply
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

ADI rolls out A²B 2.0 for automotive audio with higher bandwidth

ADI rolls out A²B 2.0 for automotive audio with higher bandwidth

May 1, 2026
0
Microchip expands atomic clock production capacity with new Alabama facility

Microchip expands atomic clock production capacity with new Alabama facility

May 1, 2026
0
Nexperia China says operations stable after parent risk warning

Nexperia China says operations stable after parent risk warning

April 30, 2026
0
TDK rolls out compact DC-DC modules for industrial and chip equipment

TDK rolls out compact DC-DC modules for industrial and chip equipment

April 30, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator