SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Rogue Valley to receive $6.7 million in subsidies for new 300mm wafer fab
  • 0

Rogue Valley to receive $6.7 million in subsidies for new 300mm wafer fab

SemiMediaEdit
July 5, 2024

July 5, 2024 /SemiMedia/ -- According to reports, MEMS wafer foundry Rogue Valley Microdevices will receive up to $6.7 million in direct government funding under the CHIPS Act to build its next 300mm wafer fab.

The report pointed out that Rogue Valley has signed a non-binding preliminary memorandum of terms with the US Department of Commerce to support its construction of a second wafer fab in Palm Bay, Florida, which will have the production capacity of 300mm wafers.

“We are working to ensure American companies have a steady domestic supply of MEMS technology as global demand increases,” said U.S. Secretary of Commerce Gina Raimondo.

“As the first MEMS foundry to receive CHIPS Act funding, Rogue Valley is committed to domestic manufacturing of advanced microelectronics. We plan to use this funding to increase production of tiny smart sensors that are critical to markets that require a strong supply chain, including automotive, biomedical and industrial. We will also expand our foundry on the West Coast of Oregon to a new facility on Florida’s Space Coast, which will soon become the industry’s first MEMS pure-play foundry to offer 300mm capacity,” said Jessica Gomez, founder and CEO of Rogue Valley.

Related

electronic components news Electronic components supplier Electronic parts supplier Rogue Valley
Infineon announces collaboration with Swoboda on high-performance current sensors for EVs
Previous
Japan's chip production equipment sales are expected to grow 15% in fiscal 2024
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

ST launches 800V power conversion for AI servers

ST launches 800V power conversion for AI servers

March 24, 2026
0
Diodes releases multi-phase boost controller for automotive lighting power design

Diodes releases multi-phase boost controller for automotive lighting power design

March 23, 2026
0
Kioxia to discontinue TSOP NAND flash, last shipments in 2027

Kioxia to discontinue TSOP NAND flash, last shipments in 2027

March 23, 2026
0
MPS to raise prices on select products from May

MPS to raise prices on select products from May

March 23, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • Electronic components distributor
  • NXP

SemiMediaEdit

Administrator