May 1, 2024 /SemiMedia/ -- According to the supply chain, semiconductor packaging and testing company ASE plans to spend nearly NT$10 billion to build the first advanced packaging factory in Kumamoto, Japan.
Industry insiders said that the Japanese government and ASE are in negotiation, and the relevant subsidies and investment details have been roughly finalized. The factory will be located in Kumamoto, which is close to TSMC, and is planned to be put into production before the end of 2027.
As early as 2004, ASE bought the ownership of NEC's IC packaging and testing plant in Yamagata Prefecture, Japan for US$80 million. In recent years, with the Japanese government's vigorous promotion of the development of the semiconductor industry, ASE plans to seize the opportunity for Japan's semiconductor recovery.
