April 11, 2024 /SemiMedia/ -- According to reports, Malaysia occupies 13% of the global market share in chip packaging, assembly and testing services, and its share will continue to rise in the future.

The report pointed out that amid weak global chip demand, Malaysia’s exports of semiconductor devices and integrated circuits will increase by 0.03% in 2023, reaching 387.45 billion Malaysian ringgit (approximately $81.4 billion).

Intel said in December 2021 that it would invest more than $7 billion to build a chip packaging and testing factory in Malaysia, with production expected to begin in 2024.

In August 2023, Infineon announced that it would invest up to 5 billion euros in the second phase of the Kulim fab in the next five years.

Neways, a major supplier to chip production equipment maker ASML, said last month it would build a new production facility in Klang.

The report pointed out that the tension between China and the United States has prompted semiconductor companies to diversify their businesses, and Malaysia has emerged as an investment hotspot in the semiconductor industry.