SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Insider: SK Hynix plans to build advanced packaging factory in Indiana
  • 0

Insider: SK Hynix plans to build advanced packaging factory in Indiana

SemiMediaEdit
March 28, 2024

March 28, 2024 /SemiMedia/ -- According to insiders, SK Hynix plans to invest $4 billion to build an advanced chip packaging factory in Indiana, USA.

The new SK Hynix factory, located adjacent to Purdue University, is expected to create about 800 to 1,000 jobs, insiders said.

The factory is scheduled to start operations in 2028, and SK Hynix’s board of directors will soon vote on the construction plan to finalize this decision. SK Hynix chose Indiana as the location to build the factory, in part because Purdue University could provide a large pool of skilled engineers.

It is estimated that the cost for SK Hynix to build a packaging factory in the United States will be about 30% to 35% higher than building a similar factory in South Korea. However, SK Hynix will receive state and federal tax incentives and other forms of support to fund its plans to build the factory, which will help offset some of the increased costs.

Related

electronic components news Electronic components supplier Electronic parts supplier SK Hynix Indiana
Renesas releases world’s first general-purpose 32-bit RISC-V MCU with in-house developed CPU core
Previous
Infineon launches industry’s lowest on-resistance 80 V MOSFET for automotive applications
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

China and EU push for progress on Nexperia case as chip supply risks persist

China and EU push for progress on Nexperia case as chip supply risks persist

November 27, 2025
0
DRAM prices set to climb in Q4 as HBM demand tightens supply

DRAM prices set to climb in Q4 as HBM demand tightens supply

November 27, 2025
0
Rapidus advances 1.4nm roadmap as Japan strengthens push into leading-edge chipmaking

Rapidus advances 1.4nm roadmap as Japan strengthens push into leading-edge chipmaking

November 27, 2025
0
Global chip market tops $200 billion in Q3 2025 as AI demand drives broad rebound

Global chip market tops $200 billion in Q3 2025 as AI demand drives broad rebound

November 26, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator