SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › TSMC: Customers want us to build ten fabs to meet AI chip demand
  • 0

TSMC: Customers want us to build ten fabs to meet AI chip demand

SemiMediaEdit
March 4, 2024

March 4, 2024 /SemiMedia/ -- According to reports, TSMC founder Chang Chung-mou mentioned in a recent interview that some customers expressed the hope that TSMC can build ten new wafer fabs for artificial intelligence (AI) chips.

The report pointed out that due to the booming demand for AI processors, NVIDIA was unable to meet the market demand for GPUs, so the market required suppliers to produce more processors.

TSMC is one of the few semiconductor manufacturers in the world with a monthly production capacity of about 100,000 wafers, but the cost of building a large-scale wafer fab is very high. A large-scale 3nm process wafer fab, fully built and equipped, may cost more than $20 billion and require many years of construction time. The cost of ten advanced wafer fabs will exceed US$200 billion, excluding supply chain support and infrastructure costs. Therefore, even TSMC cannot afford it.

The report revealed that TSMC’s capital expenditure in 2024 is US$28 billion to US$32 billion, so it is unable to build so many wafer fabs in the short term. However, production can be expected to increase within a reasonable range to meet market demand.

Related

AI chips demand Electronic components supplier Electronic componets news Electronic parts supplier TSMC
ST launches flexible synchronous rectifiers for high-efficiency silicon or GaN converters
Previous
Altera is back
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Microchip launches automotive SPE PHYs with MACsec security

Microchip launches automotive SPE PHYs with MACsec security

May 11, 2026
0
Vishay launches compact proximity sensor with 600 mm detection

Vishay launches compact proximity sensor with 600 mm detection

May 7, 2026
0
Murata introduces bulk case packaging to replace T&R, improving MLCC supply chain efficiency

Murata introduces bulk case packaging to replace T&R, improving MLCC supply chain efficiency

May 6, 2026
0
STMicroelectronics launches low-power image sensors for always-on vision devices

STMicroelectronics launches low-power image sensors for always-on vision devices

May 6, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator