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SK Hynix plans to build an advanced packaging factory in the United States, reports say

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February 2, 2024

February 2, 2024 /SemiMedia/ -- According to reports, memory chip manufacturer SK Hynix plans to build a cutting-edge technology chip packaging factory in Indiana, USA, which will promote the introduction of more artificial intelligence (AI) chip supply chains in the United States.

The report pointed out that SK Hynix’s new packaging factory will stack DRAM chips to create high-bandwidth memory (HBM) chips, which will then be integrated with Nvidia’s GPUs for training systems such as OpenAI’s ChatGPT.

"If SK Hynix builds an advanced HBM memory packaging plant in the United States, coupled with TSMC's factory in Arizona, it will allow Nvidia to complete GPU production in the United States," analysts said.

The report pointed out that integrating SK Hynix's advanced packaging technology more deeply into Nvidia's supply chain will help the company fend off competition from other HBM manufacturers such as Samsung and Micron.

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