SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › SK Hynix plans to build an advanced packaging factory in the United States, reports say
  • 0

SK Hynix plans to build an advanced packaging factory in the United States, reports say

SemiMediaEdit
February 2, 2024

February 2, 2024 /SemiMedia/ -- According to reports, memory chip manufacturer SK Hynix plans to build a cutting-edge technology chip packaging factory in Indiana, USA, which will promote the introduction of more artificial intelligence (AI) chip supply chains in the United States.

The report pointed out that SK Hynix’s new packaging factory will stack DRAM chips to create high-bandwidth memory (HBM) chips, which will then be integrated with Nvidia’s GPUs for training systems such as OpenAI’s ChatGPT.

"If SK Hynix builds an advanced HBM memory packaging plant in the United States, coupled with TSMC's factory in Arizona, it will allow Nvidia to complete GPU production in the United States," analysts said.

The report pointed out that integrating SK Hynix's advanced packaging technology more deeply into Nvidia's supply chain will help the company fend off competition from other HBM manufacturers such as Samsung and Micron.

Related

electronic components news Electronic components supplier Electronic parts supplier SK Hynix
TDK launches SMD design varistor with high surge current capability
Previous
Murata launches new automotive-grade power inductors with improved DC resistance and current rating
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Littelfuse unveils foldback TVS diode series for advanced DC power protection

Littelfuse unveils foldback TVS diode series for advanced DC power protection

July 30, 2025
0
Electronic component prices climb as industrial and EV markets revive

Electronic component prices climb as industrial and EV markets revive

July 30, 2025
0
Global foundry revenue to surpass $165 billion in 2025 driven by advanced nodes

Global foundry revenue to surpass $165 billion in 2025 driven by advanced nodes

July 29, 2025
0
onsemi expands SiC partnership with Schaeffler for next-gen PHEV platform

onsemi expands SiC partnership with Schaeffler for next-gen PHEV platform

July 29, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator