SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › ASE invests $14.7 million to expand advanced packaging capacity in Malaysia
  • 0

ASE invests $14.7 million to expand advanced packaging capacity in Malaysia

SemiMediaEdit
January 22, 2024

January 22, 2024 /SemiMedia/ -- According to reports, ASE Group announced that its Malaysian subsidiary invested 69.696 million ringgit (approximately US$14.743 million) to acquire a piece of land in a science and technology park in Penang, Malaysia.

Industry insiders said that ASE’s investment in Penang, Malaysia is to expand advanced packaging production capacity.

The report pointed out that in recent years, ASE has actively expanded the production capacity of its packaging and testing plant in Malaysia. In November 2022, the fourth and fifth new plants in Penang, Malaysia, broke ground and are expected to be completed in 2025. ASE revealed at the time that it would invest US$300 million within five years to expand its production plant in Malaysia, purchase advanced equipment, and train more engineering talents.

ASE pointed out in September 2023 that the annual turnover of the Penang plant is approximately US$350 million. It is estimated that the Penang plant's turnover will double to US$750 million in 2 to 3 years.

According to public information, the products of ASE’s packaging and testing plant in Penang, Malaysia include lead frame packaging, BGA packaging, flip chip packaging, memory packaging, wafer level chip size packaging (WLCSP), etc.

Related

ASE Malaysia electronic components news Electronic components supplier Electronic parts supplier
Renesas Electronics releases new 64-bit microprocessor for IoT edge and gateway devices
Previous
Synopsys announces acquisition of Ansys
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Micron’s HBM4 delay threatens its position in the next AI memory cycle

Micron’s HBM4 delay threatens its position in the next AI memory cycle

November 7, 2025
0
Kaga Electronics expands Thai PCBA capacity to capture China manufacturing shift

Kaga Electronics expands Thai PCBA capacity to capture China manufacturing shift

November 7, 2025
0
SEMI says AI-driven demand supports 12-inch wafer expansion in Q3

SEMI says AI-driven demand supports 12-inch wafer expansion in Q3

November 7, 2025
0
Infineon TLE994x/TLE995x SoC targets small automotive BLDC and BDC motors

Infineon TLE994x/TLE995x SoC targets small automotive BLDC and BDC motors

November 6, 2025
0
1
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator